Finite Element Analysis of Thermal Residual Stresses Fields in Diamond Films/Si Substrate

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JOURNAL OF SYNTHETIC CRYSTALS ›› 2007, Vol. 36 ›› Issue (2): 377-380.

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Finite Element Analysis of Thermal Residual Stresses Fields in Diamond Films/Si Substrate

TANG Da-pei;GAO Qing

Online:2007-04-15 Published:2021-01-20

Abstract

CLC Number:

TB43

TANG Da-pei;GAO Qing. Finite Element Analysis of Thermal Residual Stresses Fields in Diamond Films/Si Substrate[J]. Journal of Synthetic Crystals, 2007, 36(2): 377-380.

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Finite Element Analysis of Thermal Residual Stresses Fields in Diamond Films/Si Substrate

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