Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw

JOURNAL OF SYNTHETIC CRYSTALS ›› 2009, Vol. 38 ›› Issue (2): 372-377.

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Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw

GAO Yu-fei;GE Pei-qi;LI Shao-jie

Online:2009-04-15 Published:2021-01-20

Abstract

CLC Number:

TG58

GAO Yu-fei;GE Pei-qi;LI Shao-jie. Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw[J]. Journal of Synthetic Crystals, 2009, 38(2): 372-377.

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Study on the Machining Performance of Single Crystal Silicon Wafer Cut by Using Reciprocating Electroplated Diamond Wire Saw

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