[1] |
ZHANG Xi, ZHU Ruzhong, ZHANG Xuqing, WANG Minghua, GAO Yu, WANG Rong, YANG Deren, PI Xiaodong.
Influence of Abrasive Morphology and Dispersion Medium on Lapping Quality of 4H-SiC Wafers
[J]. JOURNAL OF SYNTHETIC CRYSTALS, 2023, 52(1): 48-55.
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[2] |
WU Yu-hou;WANG Hao;LI Song-hua;WANG He;SUN Jian;WANG Ding-wen.
Experimental Study on Grinding Force and Temperature of HIPSN Ceramics
[J]. JOURNAL OF SYNTHETIC CRYSTALS, 2019, 48(8): 1527-1533.
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[3] |
LIN Zhi-fu;GAO Shang;KANG Ren-ke;WANG Zi-guang;GENG Zong-chao.
Research on Grinding Performance of Fixed-abrasive Diamond Lapping Plates for Sapphire Substrates
[J]. JOURNAL OF SYNTHETIC CRYSTALS, 2016, 45(5): 1317-1322.
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[4] |
DAI Zi-hua;ZHU Yong-wei;WANG Jia-shun;XIAO Ren-jie;ZHU Lin;LI Jun.
Effect of Grit Size on the Sub-surface Damage of Work-piece Lapped by FAP
[J]. JOURNAL OF SYNTHETIC CRYSTALS, 2015, 44(11): 2970-2977.
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[5] |
XIAO Qiang.
Research on the Material Removal Rates and Surface Features of SiC Single Crystal by Ultrasonic Polishing
[J]. JOURNAL OF SYNTHETIC CRYSTALS, 2011, 40(2): 496-499.
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