Research on Normal Cutting Force of Transverse Ultrasonic-assisted Wire Saw Vibration Cutting SiC Monocrystal Wafer

JOURNAL OF SYNTHETIC CRYSTALS ›› 2015, Vol. 44 ›› Issue (12): 3730-3736.

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Research on Normal Cutting Force of Transverse Ultrasonic-assisted Wire Saw Vibration Cutting SiC Monocrystal Wafer

LI Lun;LI Yan-jun;LI Ji-shun

Online:2015-12-15 Published:2021-01-20

Abstract

CLC Number:

TQ127.7
TG74+9

LI Lun;LI Yan-jun;LI Ji-shun. Research on Normal Cutting Force of Transverse Ultrasonic-assisted Wire Saw Vibration Cutting SiC Monocrystal Wafer[J]. Journal of Synthetic Crystals, 2015, 44(12): 3730-3736.

Research on Normal Cutting Force of Transverse Ultrasonic-assisted Wire Saw Vibration Cutting SiC Monocrystal Wafer

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