Research on the Influence of Ambient Temperature on Material Removal Rate of Germanium Wafer in Low Temperature Polishing

JOURNAL OF SYNTHETIC CRYSTALS ›› 2015, Vol. 44 ›› Issue (3): 587-592.

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Research on the Influence of Ambient Temperature on Material Removal Rate of Germanium Wafer in Low Temperature Polishing

ZHAO Yan;ZUO Dun-wen;SUN Yu-li;WANG Min

Online:2015-03-15 Published:2021-01-20

Abstract

CLC Number:

TN304.11

ZHAO Yan;ZUO Dun-wen;SUN Yu-li;WANG Min. Research on the Influence of Ambient Temperature on Material Removal Rate of Germanium Wafer in Low Temperature Polishing[J]. Journal of Synthetic Crystals, 2015, 44(3): 587-592.

Research on the Influence of Ambient Temperature on Material Removal Rate of Germanium Wafer in Low Temperature Polishing

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