3D Time-space Evolution Characteristics of Si3N4 Ceramics during the Failure Process of Edge Chipping

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JOURNAL OF SYNTHETIC CRYSTALS ›› 2015, Vol. 44 ›› Issue (8): 2271-2276.

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3D Time-space Evolution Characteristics of Si3N4 Ceramics during the Failure Process of Edge Chipping

TANG Xiu-jian;WANG Jian-quan;TIAN Xin-li;LIU Qian;WU Zhi-yuan;LEI Lei

Online:2015-08-15 Published:2021-01-20

Abstract

CLC Number:

TB32

TANG Xiu-jian;WANG Jian-quan;TIAN Xin-li;LIU Qian;WU Zhi-yuan;LEI Lei. 3D Time-space Evolution Characteristics of Si3N4 Ceramics during the Failure Process of Edge Chipping[J]. Journal of Synthetic Crystals, 2015, 44(8): 2271-2276.

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3D Time-space Evolution Characteristics of Si3N4 Ceramics during the Failure Process of Edge Chipping

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