Effect of Acidic Slurries on Lapping Spinel Wafer with Fixed Abrasive Pad

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JOURNAL OF SYNTHETIC CRYSTALS ›› 2016, Vol. 45 ›› Issue (2): 339-345.

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Effect of Acidic Slurries on Lapping Spinel Wafer with Fixed Abrasive Pad

WANG Zhan-kui;ZHU Yong-wei;SU Jian-xiu;LI Yong-feng;ZHU Nan-nan

Online:2016-02-15 Published:2021-01-20

Abstract

CLC Number:

TH161
TG74+1

WANG Zhan-kui;ZHU Yong-wei;SU Jian-xiu;LI Yong-feng;ZHU Nan-nan. Effect of Acidic Slurries on Lapping Spinel Wafer with Fixed Abrasive Pad[J]. Journal of Synthetic Crystals, 2016, 45(2): 339-345.

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Effect of Acidic Slurries on Lapping Spinel Wafer with Fixed Abrasive Pad

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