Abstract: Influence factors of the friction performance of the lubricating agent in the water-based cutting fluid for crystal wafer cutting were mainly studied.The low molecular weight polyethylene glycol (PEG) was used as the lubricant, and the tribological properties of PEG with different molecular weight were analysized.In the case of using PEG300 as a water-based cutting fluid lubricant, it is possible to reduce the roughness of the surface of the wafer by more than 86.51; compared with pure water;the wear volume can be reduced by 50; and the wear surface of the worn surface is reduced

Key words: Influence factors of the friction performance of the lubricating agent in the water-based cutting fluid for crystal wafer cutting were mainly studied.The low molecular weight polyethylene glycol (PEG) was used as the lubricant, and the tribological properties of PEG with different molecular weight were analysized.In the case of using PEG300 as a water-based cutting fluid lubricant, it is possible to reduce the roughness of the surface of the wafer by more than 86.51; compared with pure water;the wear volume can be reduced by 50; and the wear surface of the worn surface is reduced