[1] 田欣利,徐西鹏,袁巨龙.工程陶瓷先进加工与质量控制技术[M].北京:国防工业出版社,2014. TIAN X L, XU X P, YUAN J L, et al. Advanced processing and quality control technology of engineering ceramics[M]. Beijing: National Defense Industry Press, 2014(in Chinese). [2] 孙 黎,贾志新,王 津,等.金刚石线锯切割绝缘陶瓷的切缝精度研究[J].机床与液压,2017,45(21):113-116. SUN L, JIA Z X, WANG J, et al. Research on kerf accuracy for insulating ceramics in fixed abrasive diamond wire saw cutting[J]. Machine Tool & Hydraulics, 2017, 45(21): 113-116(in Chinese). [3] 高 航,孔维邈.脆性材料用固结金刚石线锯切割技术研究进展[J].金刚石与磨料磨具工程,2019,39(4):97-102. GAO H, KONG W M. Development of consolidated diamond wire saw cutting technology for brittle materials[J]. Diamond & Abrasives Engineering, 2019, 39(4): 97-102(in Chinese). [4] 张辽远,尚明伟,赵 炎,等.金刚石线锯切割碳纤维复合材料实验研究[J].兵工学报,2016,37(11):2044-2049. ZHANG L Y, SHANG M W, ZHAO Y, et al. Study of diamond wire saw cutting of carbon fiber composite material[J]. Acta Armamentarii, 2016, 37(11): 2044-2049(in Chinese). [5] 张辽远,褚桂君,慕 丽.电镀金刚石线锯锯切轨迹的研究[J].兵工学报,2011,32(5):607-612. ZHANG L Y, CHU G J, MU L. Research on the sawing trajectory of electroplated diamond wire saw[J]. Acta Armamentarii, 2011, 32(5): 607-612(in Chinese). [6] 李淑娟,刘 永,侯晓莉,等.SiC单晶片加工过程中切割力的分析与建模[J].机械工程学报,2015,51(23):189-195+204. LI S J, LIU Y, HOU X L, et al. Analysis and modeling cutting force for SiC monocrystal wafer processing[J]. Journal of Mechanical Engineering, 2015, 51(23): 189-195+204(in Chinese). [7] 孟剑峰,韩云鹏,葛培琪.硬脆材料的环形电镀金刚石线锯加工试验研究[J].金刚石与磨料磨具工程,2007,27(3):56-59. MENG J F, HAN Y P, GE P Q. Cutting hard-brittle materials with endless electroplated diamond wire saw[J]. Diamond & Abrasives Engineering, 2007, 27(3): 56-59(in Chinese). [8] 庞继伟,高玉飞,李 升.电镀金刚石线锯切割光伏多晶硅的表面特性与锯丝磨损分析[J].金刚石与磨料磨具工程,2019,39(5):92-96. PANG J W, GAO Y F, LI S. Surface characteristics and wire wear of electroplated diamond wire saw slicing photovoltaic polycrystalline silicon[J]. Diamond & Abrasives Engineering, 2019, 39(5): 92-96(in Chinese). [9] 卢新郁.磨料水射流圆形零件加工技术研究[D].济南:山东大学,2006. LU X Y. A study on abrasive waterjet machining technology for circular parts[D]. Jinan: Shandong University, 2006(in Chinese). [10] 郭俊文,苏宇飞.线速度对金刚石线锯及硅片表面质量的影响[J].工具技术,2019,53(11):63-66. GUO J W, SU Y F. Influence of wire speed on diamond wire saw and surface quality of silion wafer[J]. Tool Engineering, 2019, 53(11): 63-66(in Chinese). |