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JOURNAL OF SYNTHETIC CRYSTALS ›› 2022, Vol. 51 ›› Issue (6): 1003-1011.

• Research Articles • Previous Articles     Next Articles

Lattice Perfection of Dislocation-Free (100) Te-GaSb Single Crystal Polished Substrate

FENG Yinhong1,2, SHEN Guiying1,3,4, ZHAO Youwen1,3,4,5, LIU Jingming1, YANG Jun1, XIE Hui1, HE Jianjun3,4, WANG Guowei6   

  1. 1. Key Laboratory of Semiconductor Materials Science, Beijing Key Laboratory of Low Dimensional Semiconductor Materials and Devices, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China;
    2. University of Chinese Academy of Sciences, Beijing 100049, China;
    3. Rugao Institute of Compound Semiconductor Industry, Rugao 226500, China;
    4. Jiangsu Qinxi New Material Co., Ltd., Rugao 226500, China;
    5. College of Materials Science and Opto-Electronic Technology, University of Chinese Academy of Sciences, Beijing 100049, China;
    6. State Key Laboratory for Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
  • Received:2022-02-28 Online:2022-06-15 Published:2022-07-18

Abstract: The dislocation etch pit density (EPD) of the 2-inch diameter n-type (100) Te-GaSb single crystal grown in batches by the liquid encapsulated Czochralski (LEC) method is usually lower than 300 cm-2, reaching dislocation-free level. In this paper, the lattice perfection and subsurface damage of this GaSb single crystal polished substrate were characterized by X-ray rocking curve and reciprocal space map (RSM). The results show that after chemical mechanical polishing with optimized process conditions, the surface of GaSb single crystal substrate is atomically smooth, and there is no subsurface damaged layer. High-quality type-Ⅱ superlattice epitaxial materials can be stably grown on this substrate by molecular beam epitaxy and exhibit excellent infrared detection performance. On this basis, the internal relationship between the physical properties, growth preparation and substrate processing conditions of GaSb substrate materials was comprehensively analyzed.

Key words: GaSb, substrate, liquid encapsulated Czochralski method, lattice perfection, dislocation etch pit density, RSM, subsurface damage, compound semiconductor

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