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Journal of Synthetic Crystals ›› 2026, Vol. 55 ›› Issue (2): 173-181.DOI: 10.16553/j.cnki.issn1000-985x.2025.0206

• Research Articles • Previous Articles     Next Articles

Simulation Study of Mid-Infrared Electro-Optic Modulators Based on Thin-Film Lithium Niobate Heterogeneously Integrated with Chalcogenide Glass

PAN Kaiyan1,2,3(), CAI Heyi1,2,3, DU Qingyang4, QIN Qi5, HU Xiaopeng1,2,3(), ZHU Shining1,2,3   

  1. 1.College of Engineering and Applied Sciences,Nanjing University,Nanjing 210093,China
    2.National Laboratory of Solid State Microstructures,Nanjing University,Nanjing 210093,China
    3.Key Laboratory of Intelligent Optical Sensing and Manipulation,Ministry of Education,Nanjing University,Nanjing 210093,China
    4.Zhejiang Lab,Hangzhou 311121,China
    5.City University of Hong Kong,Hong Kong 999077,China
  • Received:2025-09-24 Online:2026-02-20 Published:2026-03-06

Abstract: The mid-infrared (MIR) 3~5 μm band spans both an atmospheric transmission window and the molecular fingerprint region,enabling important applications in free-space optical communications,spectroscopic sensing,and thermal imaging. High-speed,low-loss modulators in this band are essential for advancing MIR photonic integrated systems,yet remain challenging to realize. Conventional platforms such as silicon,silicon nitride,aluminum nitride,and gallium arsenide often suffer from carrier absorption,thermo-optic effects,or limited electro-optic (EO) bandwidth in the MIR,making it difficult to simultaneously achieve high modulation efficiency and broad bandwidth. Thin-film lithium niobate (LNOI),featuring a wide transparency window and a strong Pockels effect,is a promising platform for ultrahigh-speed EO modulation;however,commercial LNOI wafers typically incorporate a SiO2 buried-oxide (BOX) layer whose pronounced absorption in the MIR band introduces excess propagation loss,thereby limiting MIR device performance and system-level integration.In this work,the BOX-absorption-induced loss bottleneck was addressed by aiming to develop a low-loss,high-efficiency,and ultrabroadband MIR EO modulator compatible with standard commercial LNOI wafers. A heterogeneously integrated LNOI/chalcogenide-glass (ChG) platform was proposed and numerically investigated. The key idea is to employ refractive-index-tunable ChG as an optical guiding layer,with a ChG strip waveguide integrated on the LNOI surface. This design pulls the optical mode upward and markedly reduces modal overlap with the SiO2 BOX layer. This mode-engineering strategy suppresses MIR absorption loss while introducing additional degrees of freedom—via the ChG refractive index and waveguide geometry—for co-optimizing propagation loss,modulation efficiency,and EO bandwidth.A Mach-Zehnder modulator was designed on a representative X-cut LNOI/SiO2/Si stack,consisting of a ~900-nm-thick lithium niobate film,a ~4.7-μm-thick SiO2 BOX layer,and a ~500-μm-thick silicon substrate. The device incorporated 1×2 multimode-interference splitters/combiners and a push-pull traveling-wave electrode phase shifter. A multiphysics co-simulation framework was employed for joint optical-RF optimization:on the optical side,the ChG refractive index and key geometric parameters were systematically swept to tailor the modal distribution and minimize propagation loss;on the RF side,electromagnetic simulations were used to optimize electrode dimensions and spacing,enabling optical-microwave group-index matching,reduced microwave attenuation,and favorable impedance matching,thereby enhancing the EO 3 dB bandwidth.After comprehensive optimization,the proposed device achieves,at 4.1 μm,a low propagation loss of 0.67 dB/cm,a half-wave voltage-length product of 14.7 V·cm,and an EO 3 dB bandwidth exceeding 110 GHz,demonstrating a compelling combination of low loss,high efficiency,and ultrabroad bandwidth. Overall,these results establish refractive-index-engineered ChG-assisted mode engineering as an effective route to mitigate BOX absorption on commercial LNOI wafers. Compared with alternative approaches relying on deep etching,BOX removal,or substrate re-engineering,this hetero-integration strategy achieves substantial performance improvements with low process invasiveness,offering enhanced platform compatibility and scalability. These findings provide a transferable design paradigm for compact,high-performance MIR EO modulators and may facilitate further advances in high-speed on-chip modulation for MIR communications,sensing,and quantum information processing.

Key words: thin-film lithium niobate; chalcogenide glass; heterogeneous integration; electro-optic modulator; mid-infrared band; integrated photon technique

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