关键词: SiC/Al复合材料;无压浸渗;导热率;电子封装

Abstract: High thermal conductivity SiC/Al composites were prepared by presureless infiltration method , the crystal phases , micrographs and thermal conductivity were analysed by XRD , SEM and laser thermal conductance instrument .The effect of SiC particle size , shape , volume fraction , Mg content and the pre-oxidation on thermal conductivity of samples were studied .The results show:the thermal conductivity of samples can be as high as 172 .27 W/( m · k ) and meet the eletronic packing materials requirements with suitable raw materials and process parameters .

Key words: High thermal conductivity SiC/Al composites were prepared by presureless infiltration method , the crystal phases , micrographs and thermal conductivity were analysed by XRD , SEM and laser thermal conductance instrument .The effect of SiC particle size , shape , volume fraction , Mg content and the pre-oxidation on thermal conductivity of samples were studied .The results show:the thermal conductivity of samples can be as high as 172 .27 W/( m · k ) and meet the eletronic packing materials requirements with suitable raw materials and process parameters .