欢迎访问《人工晶体学报》官方网站,今天是 分享到:

人工晶体学报 ›› 2020, Vol. 49 ›› Issue (12): 2244-2251.

• 研究论文 • 上一篇    下一篇

He离子注入对Ge中缺陷行为的影响研究

柯海鹏1, 欧雪雯2, 柯少颖2   

  1. 1.福建省漳州第一职业中专学校,漳州 363000;
    2.闽南师范大学物理与信息工程学院,漳州 363000
  • 出版日期:2020-12-15 发布日期:2021-01-25
  • 通信作者: 柯少颖,博士,副教授。E-mail:syke@mnnu.edu.cn
  • 作者简介:柯海鹏(1977—),男,福建省人,高级讲师。E-mail:kehaipeng@163.com
  • 基金资助:
    国家自然科学基金(62004087);福建省自然科学基金(2020J01815);漳州市自然科学基金(ZZ2020J32);闽南师范大学校长基金(KJ19014)

Effect of He Ion Implantation on the Defect Behaviour in Ge

KE Haipeng1, OU Xuewen2, KE Shaoying2   

  1. 1. Zhangzhou First Vocational Secondary School, Zhangzhou 363000, China;
    2. College of Physics and Information Engineering, Minnan Normal University, Zhangzhou 363000, China
  • Online:2020-12-15 Published:2021-01-25

摘要: 本文采用以蒙特卡罗方法为基础的SRIM软件模拟He离子注入对Ge中缺陷行为的影响,为高质量GOI(绝缘体上Ge)材料的制备提供理论指导。本文主要模拟了He离子入射角度、能量以及注入剂量对Ge材料损伤程度和溅射产额等的影响。研究表明:入射角度较小时,拖尾效应不明显,有利于避免沟道效应,同时缺陷空位数(DPA)也处于较低水平;能量增大导致离子射程增大,溅射产额减小,离表面越近的Ge中DPA变少,可以实现低DPA GOI材料的制备;离子注入剂量增大导致损伤区域增大且集中,然而更多的He离子聚集在射程附近,能够很好地降低GOI材料的剥离温度。

关键词: He离子注入, 射程, 缺陷空位数, 绝缘体上Ge

Abstract: In this study, SRIM software based on the Monte Carlo method is used to simulate the defect behavior in Ge during He ion implantation, which provides theoretical guidance for the preparation of high-quality GOI (Ge on insulator) materials. The effect of the implantation angle, energy, and dose of the He ion on the damage degree and sputtering yield in Ge material was investigated. The results show that, the training effect is not serious when the incident angle is low. The channel effect can be avoided and the DPA in Ge material can be decreased. With the increase of the energy, the project range increases and the sputtering yield decreases. Moreover, the DPA in the Ge near surface decreases with the increase of the energy, indicating the low DPA in the GOI(Germanium-on-Insulator, GOI) material. The increase of ion implantation dose leads to the increase of the damage area and the aggregation of the defects. Moreover, when the dose increases, more He ions aggregate near the project range. This may lead to the decrease of the lift-off temperature of GOI material.

Key words: He ion implantation, project range, DPA, GOI

中图分类号: