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人工晶体学报 ›› 2023, Vol. 52 ›› Issue (4): 562-570.

• 研究论文 • 上一篇    下一篇

高拉速对ø 300 mm单晶硅点缺陷分布及生产能耗的影响

徐尊豪1, 李进2, 何显2, 安百俊2, 周春玲2   

  1. 1.宁夏大学物理与电子电气工程学院,银川 750021;
    2.宁夏大学宁夏光伏材料重点实验室,银川 750021
  • 收稿日期:2022-11-05 出版日期:2023-04-15 发布日期:2023-04-28
  • 通信作者: 李 进,博士,教授。E-mail:li-jin@163.com
  • 作者简介:徐尊豪(1997—),男,宁夏回族自治区人,硕士研究生。E-mail:xuzunhao123@163.com
  • 基金资助:
    国家自然科学基金(51962030);直拉法单晶硅低能耗关键制备技术研究(2022XQZD006)

Effect of High Pulling Rate on the Distribution of Point Defects and Energy Consumption in ø 300 mm Monocrystalline Silicon

XU Zunhao1, LI Jin2, HE Xian2, AN Baijun2, ZHOU Chunling2   

  1. 1. School of Physics and Electronic-Electrical Engineering, Ningxia University, Yinchuan 750021, China;
    2. Ningxia Key Laboratory of Photovoltaic Materials, Ningxia University, Yinchuan 750021, China
  • Received:2022-11-05 Online:2023-04-15 Published:2023-04-28

摘要: 大尺寸直拉单晶硅的“增效降本”是当前光伏企业急需解决的问题。本文采用有限元体积法对ø300 mm直拉单晶硅生长过程分别进行稳态和非稳态全局模拟,研究提高拉晶速率对直拉单晶硅生长过程中的固液界面、点缺陷分布以及生长能耗的影响。结果表明:拉晶速率提高为1.6 mm/min时固液界面的偏移量为33 mm,不会影响晶体的稳定生长;拉晶速率对晶体中点缺陷的分布起决定性作用,提高拉晶速率不仅能降低自间隙点缺陷的浓度,而且使晶棒内V/G始终高于临界值;且拉晶速率对功率消耗影响较大,提高拉晶速率后晶体生长时间减少了46.4%,单根晶体生长消耗功率降低了约4.97%。优化和控制适宜的拉晶速率有利于低成本地生长特定点缺陷分布甚至无点缺陷单晶硅,为提高大尺寸直拉单晶硅质量、降低生产能耗提供一定的理论支持。

关键词: 直拉单晶硅, 有限元体积法, 拉晶速率, 固液界面, 点缺陷, 生产能耗

Abstract: The “efficiency and cost reduction” of large size Czochralski monocrystalline silicon is an urgent problem for photovoltaic enterprises. In this paper, the finite element volume method was used to simulate the growth process of ø300 mm Czochralski monocrystalline silicon in both steady and unsteady state, respectively, to study the change rule of crystal-melt interface, point defect distribution and growth energy consumption during the growth process of Czochralski monocrystalline silicon by increasing the pulling rate. The results show that the shift of crystal-melt interface is 33 mm when the pulling rate increases to 1.6 mm/min, which would not affect the stable growth of crystals. The pulling rate plays a decisive role in the distribution of point defects in the crystal. Increaseing the pulling rate could not only reduce the concentration of self-interstital defects, but also make the V/G in the crystal bar always higher than the critical value. And the pulling rate has a great influence on the power consumption. After increasing the pulling rate, the crystal growth time is reduced by 46.4%, and the power consumption for monocrystalline silicon growth is reduced by 4.97%. Optimization and control of appropriate pulling rate is conducive to low cost growth of specific point defect distribution or even point defect free monocrystalline silicon, which provides some theoretical support for improving the quality of large size Czochralski monocrystalline silicon and reducing production energy consumption.

Key words: Czochralski monocrystalline silicon, finite element volume method, pulling rate, crystal-melt interface, point defect, energy consumption

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