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人工晶体学报 ›› 2023, Vol. 52 ›› Issue (8): 1378-1385.

• 研究论文 • 上一篇    下一篇

金刚石线锯锯切β-Ga2O3晶体应力场分析

李宗平1, 程大猛2   

  1. 1.山东省科技服务发展推进中心,济南 250101;
    2.山东大学机械工程学院,济南 250061
  • 收稿日期:2023-03-16 出版日期:2023-08-15 发布日期:2023-08-21
  • 作者简介:李宗平(1976—),男,山东省人,助理研究员。E-mail:lzp85775@163.com
  • 基金资助:
    国家重点研发计划(2022YFB3401902)

Stress Field Analysis of Diamond Wire Sawing β-Ga2O3 Crystal

LI Zongping1, CHENG Dameng2   

  1. 1. Shandong Science and Technology Service Development Promotion Center, Jinan 250101, China;
    2. School of Mechanical Engineering, Shandong University, Jinan 250061, China
  • Received:2023-03-16 Online:2023-08-15 Published:2023-08-21

摘要: 作为典型的硬脆材料,氧化镓晶体(β-Ga2O3)加工时易裂解。金刚石线锯是生产β-Ga2O3晶片的主要方式,切片加工过程中会在晶片表面产生微裂纹损伤层,应力作用下微裂纹会发生扩展,导致材料破碎和断裂。本文建立了金刚石线锯多线切割β-Ga2O3(010)晶面的有限元模型,研究了锯切过程中机械应力、热应力和热力耦合应力的分布变化规律,分析了锯丝速度、进给速度和恒速比下不同参数组合对热力耦合应力的影响。结果表明,锯切过程中锯切热产生的热应力占据热力耦合应力的主导地位,锯切力引起的机械应力占比较小,但机械应力会影响热力耦合应力的分布情况,锯丝速度和进给速度的增加会引起热力耦合应力的增加。

关键词: β-Ga2O3, 金刚石线锯, 有限元分析, 热力耦合应力, 机械应力, 热应力

Abstract: As a typical hard and brittle material, gallium oxide crystal (β-Ga2O3) is easy to crack during processing. Diamond wire saw is the main way to produce β-Ga2O3 wafers. During the slicing process, a microcrack damage layer will be generated on the surface of the wafer. Under the stress, the microcracks will expand, leading to material breakage and fracture. In this paper, a finite element model of diamond wire sawing of β-Ga2O3 (010) crystal surface was established. The distribution of mechanical stress, thermal stress, and thermal-mechanical coupling stress during the sawing process were studied. The effects of sawing wire speed, feed speed and different parameter combinations under constant speed ratio on the thermal-mechanical coupling stress were analyzed. The research results show that: the thermal stress generated by sawing heat dominates the thermal-mechanical coupling stress during the sawing process; the mechanical stress caused by sawing force has a small numerical value and proportion, but it affects the distribution of thermal-mechanical coupling stress; increasing sawing wire speed and feed speed will increase the thermal-mechanical coupling stress.

Key words: β-Ga2O3, diamond wire saw, finite element analysis, thermal-mechanical coupling stress, mechanical stress, thermal stress

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