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人工晶体学报 ›› 2022, Vol. 51 ›› Issue (12): 2137-2152.

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PVT法生长4H-SiC晶体及多型夹杂缺陷研究进展

王宇1,2,3, 顾鹏2, 付君3, 王鹏刚2, 雷沛3, 袁丽3   

  1. 1.北京大学地球与空间科学学院,北京 100871;
    2.眉山博雅新材料股份有限公司,眉山 620000;
    3.眉山天乐半导体材料有限公司,眉山 620000
  • 收稿日期:2022-07-04 出版日期:2022-12-15 发布日期:2023-01-09
  • 通讯作者: 顾 鹏,工程师。E-mail:1620472714@qq.com
  • 作者简介:王 宇(1981—),男,北京市人,博士研究生。E-mail:wangyu@sctlxd.com

Research Progress on the Growth of 4H-SiC Crystal by PVT Method and the Defect of Polytype Inclusions

WANG Yu1,2,3, GU Peng2, FU Jun3, WANG Penggang2, LEI Pei3, YUAN Li3   

  1. 1. School of Earth and Space Sciences, Peking University, Beijing 100871, China;
    2. Meishan Boya Advanced Materials Co., Ltd., Meishan 620000, China;
    3. Meishan Tianle Semiconductor Material Co., Ltd., Meishan 620000, China
  • Received:2022-07-04 Online:2022-12-15 Published:2023-01-09

摘要: 作为第三代半导体材料的典型代表,碳化硅因具备宽的带隙、高的热导率、高的击穿电场以及大的电子迁移速率等性能优势,被认为是制作高温、高频、高功率以及高压器件的理想材料之一,可有效突破传统硅基功率半导体器件的物理极限,并被誉为带动“新能源革命”的绿色能源器件。作为制造功率器件的核心材料,碳化硅单晶衬底的生长是关键,尤其是单一4H-SiC晶型制备。各晶型体结构之间有着良好的结晶学相容性和接近的形成自由能,导致所生长的碳化硅晶体容易形成多型夹杂缺陷并严重影响器件性能。为此,本文首先概述了物理气相传输(PVT)法制备碳化硅晶体的基本原理、生长过程以及存在的问题,然后针对多型夹杂缺陷的产生给出了可能的诱导因素并对相关机理进行解释,进一步介绍了常见的碳化硅晶型结构鉴别方式,最后对碳化硅晶体研究作出展望。

关键词: 碳化硅晶体, 物理气相传输, 堆垛次序, 多型夹杂, 缺陷抑制, 晶型鉴别

Abstract: Silicon carbide (SiC), as a typical representative of the third-generation semiconductor material, has performance advantages in wide band gap, high thermal conductivity, high breakdown electric field and large electron drift velocity, etc., and is considered to be one of the ideal materials for high temperature, high frequency, high power and high voltage devices. SiC can effectively break through the physical limits of traditional Si-based power semiconductor devices, known as a green energy device that drives the “new energy revolution”. As the core material for the manufacture of power devices, the growth of SiC single crystal substrate is very important, especially the preparation of single 4H-SiC polytype. Due to the better crystallographic compatibility and similar formation free energy among different polytypes, the grown SiC bulk crystals are prone to produce polytype inclusions and then seriously affect the device performance. Therefore, in this paper, the basic principle, growth process and existing problems of SiC crystal prepared by physical vapor transport (PVT) method are summarized firstly. Then the possible inducing factors for the formation of polytype inclusions were given and the relevant mechanisms are also discussed. In addition, the common identification methods of SiC polytype structures are further introduced. Finally, a prospect for the research of SiC single crystal are made.

Key words: SiC crystal, physical vapor transport, stacking sequence, polytype inclusion, defect suppression, polytype identification

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