Analysis of Temperature Field and Verification Tests on Electro-slag Induct Continuous Unidirectional Solidification Process

JOURNAL OF SYNTHETIC CRYSTALS ›› 1999, Vol. 28 ›› Issue (2): 182-187.

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Analysis of Temperature Field and Verification Tests on Electro-slag Induct Continuous Unidirectional Solidification Process

Chang Guowei;Yuan Junping;Wang Zidong;Wu Chunjing;Hu Hanqi

Online:1999-02-15 Published:2021-01-20

Abstract

CLC Number:

O795
TG111.4

Chang Guowei;Yuan Junping;Wang Zidong;Wu Chunjing;Hu Hanqi. Analysis of Temperature Field and Verification Tests on Electro-slag Induct Continuous Unidirectional Solidification Process[J]. Journal of Synthetic Crystals, 1999, 28(2): 182-187.

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Analysis of Temperature Field and Verification Tests on Electro-slag Induct Continuous Unidirectional Solidification Process

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