Numerical Analysis of Thermally-induced Stress Caused by Inclusions Embedded in Polycrystalline Silicon Ingot

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JOURNAL OF SYNTHETIC CRYSTALS ›› 2016, Vol. 45 ›› Issue (4): 923-928.

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Numerical Analysis of Thermally-induced Stress Caused by Inclusions Embedded in Polycrystalline Silicon Ingot

LIU Yao;HE Li-jun;DI Hong-xiang;GAO Mang-mang;LI Hai-bo

Online:2016-04-15 Published:2021-01-20

Abstract

CLC Number:

TM912

LIU Yao;HE Li-jun;DI Hong-xiang;GAO Mang-mang;LI Hai-bo. Numerical Analysis of Thermally-induced Stress Caused by Inclusions Embedded in Polycrystalline Silicon Ingot[J]. Journal of Synthetic Crystals, 2016, 45(4): 923-928.

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Numerical Analysis of Thermally-induced Stress Caused by Inclusions Embedded in Polycrystalline Silicon Ingot

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