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JOURNAL OF SYNTHETIC CRYSTALS ›› 2024, Vol. 53 ›› Issue (3): 480-486.

• Research Articles • Previous Articles     Next Articles

Dislocation Density Evolution Study of GaN Single Crystal Growth by Ammonothermal Method

XIA Zhenghui1,2, LI Tengkun1, REN Guoqiang1, XIE Kaihe1, LU Wenhao1, LI Shaozhe1,2, ZHENG Shunan1, GAO Xiaodong1, XU Ke1,3,4   

  1. 1. Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou 215123, China;
    2. School of Nano Science and Technology Institute, University of Science and Technology of China, Hefei 230026, China;
    3. Suzhou Nanowin Science and Technology Co., Ltd., Suzhou 215123, China;
    4. Jiangsu Institute of Advanced Semiconductors, Ltd., Suzhou 215000, China
  • Received:2023-11-09 Published:2024-04-02

Abstract: Gallium nitride (GaN) single crystal has the characteristics of high breakdown voltage, direct band gap, high saturated electron drift rate, good chemical stability, etc., and has been widely used in optoelectronic devices and high-power electronic devices. However, the heteroepitaxial of GaN produces a high dislocation density, which limits the performance of GaN devices. In this study, GaN single crystal was grown by ammonothermal method using HVPE-GaN as a seed crystal. The dislocation evolution from the seed crystal region to the lateral growth region of GaN single crystal was studied by scanning electron microscopy (SEM), optical microscopy and wet etching. The results show that the dislocation density of GaN single crystal in the lateral growth region is obviously lower than that in the seed crystal region, and the dislocation density decreases by 2 orders of magnitude when the lateral growth exceeds 25 μm.

Key words: GaN single crystal, ammonothermal method, lateral growth, dislocation density, etch pit

CLC Number: