金刚石在富氧环境下的高效抛光及其材料去除机制研究

人工晶体学报 ›› 2024, Vol. 53 ›› Issue (12): 2094-2103.

金刚石在富氧环境下的高效抛光及其材料去除机制研究

刘帅伟^1,2, 关春龙¹, 鲁云祥², 易剑², 江南², 西村一仁²

1.河南工业大学材料科学与工程学院,郑州 450001;
2.中国科学院宁波材料技术与工程研究所,海洋材料及相关技术重点实验室,浙江省海洋材料与防护技术重点实验室,宁波 315201

收稿日期:2024-08-14 出版日期:2024-12-15 发布日期:2024-12-20
通信作者: 关春龙,博士,教授。E-mail:chunlong_@haut.edu.cn
作者简介:刘帅伟(1995—),男,河南省人,硕士研究生。E-mail:332490706@qq.com
基金资助:
宁波市重大科技攻关项目(2021ZDYF020196,2021ZDYF020198)

Efficient Polishing Process of Diamond in Oxygen-Enriched Environment and Its Material Removal Mechanism

LIU Shuaiwei^1,2, GUAN Chunlong¹, LU Yunxiang², YI Jian², JIANG Nan², KAZUHITO Nishimura²

1. School of Materials Science and Engineering, Henan University of Technology, Zhengzhou 450001, China;
2. Zhejiang Key Laboratory of Marine Materials and Protection Technology, Key Laboratory of Marine Materials and Related Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China

Received:2024-08-14 Online:2024-12-15 Published:2024-12-20

摘要/Abstract

摘要： 金刚石独特的性能使其成为声、光、电、热等领域非常理想的应用材料,但其极低的材料去除率导致其加工时间极长,如何在保证抛光质量的前提下提高抛光效率一直是金刚石加工领域的热门课题。本文对常规环境与富氧环境下用金刚石砂轮抛光多晶金刚石进行了对比实验,发现在富氧环境下材料的抛光去除率达2.29 μm/h,是常规环境下抛光去除率0.25 μm/h的9倍以上,且表面质量良好。原子力显微镜表征结果表明,在30 μm×30 μm的测量范围内,富氧环境下抛光后的金刚石表面粗糙度Sa可达2 nm以下,SEM和TEM观测未发现明显的结构损伤。此外,借助XPS分析了金刚石抛光加工过程中的材料去除机制,发现在抛光加工过程中,金刚石在机械作用下表面会发生从sp³到sp²结构的相变,形成的相变层在机械和氧气的作用下被去除。同时发现在富氧环境下,相变层可以更快地被去除,说明氧化在金刚石材料去除过程中扮演着更重要的角色。

关键词: 金刚石, 抛光, 富氧环境, 材料去除率, 去除机制, 氧化

Abstract: Diamond is an excellent material for applications in acoustics, optics, electronics, and thermal management. However, their extremely low material removal rate results in very long processing durations. Therefore, it is essential to improve polishing efficiency while maintaining excellent polishing quality. In this study, a comparative experiment on the polishing of polycrystalline diamonds using diamond wheels under normal and oxygen-enriched environments has been conducted. It is found that the material removal rate reaches 2.29 μm/h under oxygen-enriched environment, which is over nine times the removal rate of 0.25 μm/h under normal condition, while maintaining good surface quality. The characterization results of atomic force microscopy indicate that, within a 30 μm×30 μm measurement area, the surface roughness Sa of the polished diamond under the oxygen-enriched environment could reach below 2 nm. Meanwhile, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) observations reveal no significant structural damage. Furthermore, the material removal mechanism during diamond polishing was analyzed by X-ray photoelectron spectroscopy (XPS), the results indicate that the diamond during polishing undergoes a phase transition from sp³ to sp² structures under mechanical action, with the resultant phase transition layer being removed under both mechanical and oxidative effects. Additionally, it is observed that in the oxygen-enriched environment, the phase transition layer is removed more rapidly, indicating that oxidation plays a more significant role in the diamond material removal process.

Key words: diamond, polishing, oxygen-enriched environment, material removal rate, removal mechanism, oxidate

中图分类号:

O786
TQ163

刘帅伟, 关春龙, 鲁云祥, 易剑, 江南, 西村一仁. 金刚石在富氧环境下的高效抛光及其材料去除机制研究[J]. 人工晶体学报, 2024, 53(12): 2094-2103.

LIU Shuaiwei, GUAN Chunlong, LU Yunxiang, YI Jian, JIANG Nan, KAZUHITO Nishimura. Efficient Polishing Process of Diamond in Oxygen-Enriched Environment and Its Material Removal Mechanism[J]. JOURNAL OF SYNTHETIC CRYSTALS, 2024, 53(12): 2094-2103.

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