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人工晶体学报 ›› 2021, Vol. 50 ›› Issue (1): 102-105.

• 研究论文 • 上一篇    下一篇

萘羧酸膦酸铜配合物的合成与表征

卜康, 吉玉如, 王楠, 徐阳, 王宣   

  1. 宿迁学院信息工程学院,材料工程系,宿迁 223800
  • 收稿日期:2020-10-11 出版日期:2021-01-15 发布日期:2021-03-01
  • 作者简介:卜 康(1999—),男,江苏省人。E-mail:1069368860@qq.com
  • 基金资助:
    宿迁学院优秀毕业设计(论文)提升与培育项目

Synthesis and Characterization of Copper Naphthoic Acid Phosphonate

BU Kang, JI Yuru, WANG Nan, XU Yang, WANG Xuan   

  1. Department of Materials Engineering, Institute of Information Engineering, Suqian University, Suqian 223800, China
  • Received:2020-10-11 Online:2021-01-15 Published:2021-03-01

摘要: 本文以萘羧酸膦酸配体(5-pncH3=(5-phosphono-1-naphthalenecarboxylic acid)和高氯酸铜为原料,在水热条件下自组装得到了一维配合物Cu0.5(5-pncH2)(H2O)1.5(1)。采用单晶衍射(X-Ray)、元素分析(EA)、红外光谱(FT-IR)、粉末衍射(Powder X-Ray)、热重分析(TG-DTG)对配合物进行晶体结构和热稳定性表征。晶体结构分析表明:该配合物结晶于正交晶系,Pbcm空间群,a=0.667 88(2) nm,b=0.884 14(2) nm,c=4.174 03(9) nm。配合物1的晶体结构中相邻的金属CuII离子由配位水分子连接成一维锯齿状无机链。这些相邻的无机链通过萘羧酸膦酸配体上未配位的双重羧基氢键连接成层状结构。热稳定性研究表明,配合物呈现出逐级分解过程,在350 ℃以下能够保持配合物骨架结构的稳定性。

关键词: 铜配合物, 自组装, 晶体结构, 热稳定性

Abstract: Self-assembly of phosphonic acid (5-pncH3=(5-phosphono-1-naphthalenecarboxylic acid) and copper perchlorate hexahydrate, 1D coordination polymer, namely Cu0.5(5-pncH2)(H2O)1.5 (1) was hydrothermally synthesized. The crystal structure and thermal stability were characterized by single-crystal X-ray diffraction, EA, FT-IR spectroscopy, powder X-ray diffraction (PXRD), and thermogravimetric analysis (TG-DTG). Structure analyses reveal that compound 1 crystallized in the orthorhombic system, space group Pbcm, a=0.667 88(2) nm, b=0.884 14(2) nm, c=4.174 03(9) nm. Compound 1 has a one-dimensional chain structure, in which the adjacent CuII ions are bridged into a one-dimensional zigzag chain through the coordination water molecules. The two-dimensional layered structure is formed by the double hydrogen bond of carboxyl group on the organic phosphonic acid ligand. The thermal stability study shows that the complex exhibits a step-by-step decomposition process, and the stability of the complex skeleton structure can be maintained below 350 ℃.

Key words: copper complex, self-assembly, crystal structure, thermal stability

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