欢迎访问《人工晶体学报》官方网站,今天是 分享到:

人工晶体学报 ›› 2024, Vol. 53 ›› Issue (12): 2027-2042.

• 综合评述 •    下一篇

4H-SiC基功率器件的high-k栅介质材料研究进展

刘帅1,2, 宋立辉1,2, 杨德仁1,2, 皮孝东1,2   

  1. 1.浙江大学材料科学与工程学院,硅及先进半导体材料全国重点实验室,杭州 310027;
    2.浙江大学杭州国际科创中心,先进半导体研究院和浙江省宽禁带功率半导体材料与器件重点实验室,杭州 311200
  • 收稿日期:2024-05-20 出版日期:2024-12-15 发布日期:2024-12-20
  • 通信作者: 宋立辉,博士,研究员。E-mail:songlihui@zju.edu.cn;皮孝东,博士,教授。E-mail:xdpi@zju.edu.cn
  • 作者简介:刘帅(1990—),女,安徽省人,博士。E-mail:0622478@zju.edu.cn
  • 基金资助:
    浙江大学杭州国际科创中心人才专项(02010600-K02013005)

Research Progress on High-k Gate Dielectrics Materials for 4H-SiC Based Power Devices

LIU Shuai1,2, SONG Lihui1,2, YANG Deren1,2, PI Xiaodong1,2   

  1. 1. State Key Laboratory of Silicon and Advanced Semiconductor Materials, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China;
    2. Institute of Advanced Semiconductors & Zhejiang Provincial Key Laboratory of Power Semiconductor Materials and Devices, ZJU-Hangzhou Global Scientific and Technological Innovation Center, Hangzhou 311200, China
  • Received:2024-05-20 Online:2024-12-15 Published:2024-12-20

摘要: 金属氧化物半导体场效应晶体管(MOSFET)作为碳化硅绝缘栅结构的典型器件被广泛使用,然而SiO2介电常数低的缺点和SiO2/4H-SiC界面特性差的问题一直制约着4H-SiC绝缘栅结构(金属-绝缘体-半导体, MIS)器件更大规模商业化应用,因此科研工作者一直致力于寻找能够替代或弥补SiO2的high-k栅介质材料。本文对该科学问题的研究现状进行综述,首先指出合适的high-k栅介质材料应该拥有较宽的禁带宽度、较高的介电常数、良好的界面特性和热稳定性。然后,主要从栅薄膜制备工艺、沉积温度、栅介质界面特性和电学性能等方面对典型high-k栅介质材料的研究结果进行评价,包括氧化铪(HfO2)、氧化铝(Al2O3)、氮化铝(AlN)、氧化钇(Y2O3)、氧化铈(CeO2)、氧化锆(ZrO2)、氧化镧(La2O3)、五氧化二钽(Ta2O5)、钛酸钡(BaTiO3)、氧化钬(Ho2O3)和由它们组合而成的堆栈栅介质。最后,对未来该领域的研究方向进行了展望和建议,例如对栅漏电流机理的研究、对新材料的更多尝试、器件在极端环境下的可靠性问题等。

关键词: 4H-SiC MOS电容器, high-k栅介质材料, 堆栈栅介质, 界面特性, 电学性能

Abstract: Metal-oxide-semiconductor field effect transistor (MOSFET) as a typical device of silicon carbide insulate gate sturcture is one of the most widely applied devices for 4H-SiC. However, the low dielectric constant of gate oxide (SiO2) and poor interface characteristics of SiO2/4H-SiC limits further application of 4H-SiC insulated gate structures (metal-insulator-semiconductor, MIS). Therefore, the research on high-k gate dielectrics which is able to substitute or compensate for SiO2 has attracted extensive attention. This paper reports several key areas on this issue to obtain a better understanding of potential high-k gate dielectrics. Firstly, an ideal gate dielectric materials for 4H-SiC would have large bandgap, high dielectric constant, good interface with 4H-SiC and favorable thermal stability. And the several methods are summarized to evaluate the structural, electrical and interface properties of gate dielectric materials. Furthermore, this paper assesses the current status of these dielectrics and their processing in terms of gate preparation, deposition temperature, interfacial propertiesand electrical performance, including HfO2, Al2O3, AlN, Y2O3, CeO2, ZrO2, La2O3, Ta2O5, BaTiO3, Ho2O3 and gate dielectric stacks composed of them. Finaly, based on an extensive survey on high-k gate dielectrics for 4H-SiC devices, a future perspective is provided with regards to gate leakage current mechanism, more efforts on varied materials and device viability in harsh environment.

Key words: 4H-SiC MOS capacitor, high-k gate dielectric material, gate dielectric stack, interfacial property, electrical performance

中图分类号: