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Journal of Synthetic Crystals ›› 2026, Vol. 55 ›› Issue (6): 898-909.DOI: 10.16553/j.cnki.issn1000-985x.2026.0017

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Optimizing Friction Coefficient of Crystalline Silicon Surfaces Using Modified Cutting Fluids

ZHU Zidan1(), GAO Bangzhi1, JI Mengxia1, CHEN Ming2, WANG Yicheng2, LIU Fujie3, XU Hui1, ZHANG Ming1()   

  1. 1.Energy Research Institute,Jiangsu University,Zhenjiang 212013,China
    2.Jiangsu Meike Solar Technology Co.,Ltd.,Zhenjiang 212200,China
    3.Zhenjiang College of Higher Vocational Education,Zhenjiang 212013,China
  • Received:2026-01-30 Online:2026-06-20 Published:2026-07-07
  • Contact: ZHANG Ming

Abstract: Driven by the global goals of carbon peak and carbon neutrality,the photovoltaic (PV) industry has become pivotal to energy transition,with crystalline silicon cells dominating over 95% of the PV market. However,commercially available crystalline silicon cutting fluids suffer from deficiencies such as inadequate dispersion and discharge of silicon powder,poor lubricity,and weak recyclability. These shortcomings severely compromise the surface precision of crystalline silicon and hinder the development of the photovoltaic industry. This study aims to overcome the aforementioned shortcomings of crystalline silicon cutting fluids by investigating the impact of different ion-liquid modified cutting fluids on crystalline silicon surface quality during the cutting process. Test results indicate that the modified cutting fluid,which incorporates 1% by mass of 1-methyl-3-octylimidazole chloride salt ([OMIM]Cl) as an ionic liquid into commercial cutting fluids,demonstrates the optimal performance. Its pH value is 6.26,the viscosity drops to 64.39 mPa·s,surface tension lowers to 24.07 mN/m,contact angle minimizes,and wetting penetration capability maximizes. Compared to the commercial cutting fluid,its friction coefficient decreases by over 60%,and wear volume decreases by 26.1%. It demonstrated excellent performance in reducing friction and enhancing crystalline silicon surface quality,offering broad prospects for widespread application.

Key words: modified cutting fluid; wire saw cutting; crystalline silicon; ionic liquid modification; surface modification

CLC Number: