[1] 余东海,王成勇,成晓玲,等.磁控溅射镀膜技术的发展[J].真空,2009,46(2):19-25. YU D H, WANG C Y, CHENG X L, et al. Recent development of magnetron sputtering processes[J]. Vacuum, 2009, 46(2): 19-25(in Chinese). [2] 程建平,杨晓东.真空磁控溅射镀膜设备及工艺技术研究[J].电子工业专用设备,2009,38(11):27-31. CHENG J P, YANG X D. Research of the vacuum magnetron sputtering deposition equipment and its prdcess[J]. Equipment for Electronic Products Manufacturing, 2009, 38(11): 27-31(in Chinese). [3] SHI F. Introductory chapter: basic theory of magnetron sputtering[M]//Magnetron Sputtering. New York: IntechOpen, 2018. [4] FEKETE A Z, KELEMEN A, JAKAB-FARKAS L. Multilevel distributed embedded system for control of the DC magnetron sputtering process[J]. Acta Universitatis Sapientiae Electrical and Mechanical Engineering, 2017, 9(1): 43-55. [5] SERÉNYI M, LOHNER T, SÁFRÁN G, et al. Comparison in formation, optical properties and applicability of DC magnetron and RF sputtered aluminum oxide films[J]. Vacuum, 2016, 128: 213-218. [6] SMY T, TAN L, WINTERTON S S, et al. Simulation of sputter deposition at high pressures[J]. Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, 1997, 15(6): 2847-2853. [7] ZOU C W, ZHANG J, XIE W, et al. Characterization and properties Ti-Al-Si-N nanocomposite coatings prepared by middle frequency magnetron sputtering[J]. Applied Surface Science, 2011, 257(24): 10373-10378. [8] 庞恩敬,朱 颖,李 芬,等.多靶磁控溅射系统磁场优化设计[J].核技术,2010,33(12):908-912. PANG E J, ZHU Y, LI F, et al. Optimal design of the magnetic field in a multi-target magnetron sputtering system[J]. Nuclear Techniques, 2010, 33(12): 908-912(in Chinese). [9] NING Y P, WANG J, SUN C Z, et al. NiCrAlO/Al2O3 solar selective coating prepared by direct current magnetron sputtering and water boiling[J]. Solar Energy Materials and Solar Cells, 2021, 219: 110807. [10] 韩成明,薛道荣,李 峰,等.内腔式磁控溅射设备与方法:CN110205595A[P].2019-09-06. HAN C M, XUE D R, LI F, et al. Inner-cavity magnetron sputtering apparatus and method: CN110205595A[P]. 2019-09-06(in Chinese). [11] 佘鹏程,彭立波,陈特超,等.一种用于薄膜混合集成电路的生产型多靶磁控溅射系统:CN106399957B[P].2019-01-08. SHE P C, PENG L B, CHEN T H, el at. The invention relates to a production type multi-target magnetron sputtering system for thin film hybrid integrated circuits: CN106399957B[P]. 2019-01-08(in Chinese). [12] 李 峰,薛道荣,韩成明,等.内腔式磁控溅射镀膜室的装配式结构:CN210237767U[P].2020-04-03. LI F, XUE D R, HAN C M, et al. An assembly structure of an inner cavity magnetron sputtering coating chamber: CN210237767U[P]. 2020-04-03(in Chinese). [13] 王 君.一种管状磁控溅射源,磁控溅射单元及镀膜系统:CN211367711U[P].2020-08-28. WANG J. The invention relates to a tubular magnetron sputtering source, a magnetron sputtering unit and a coating system:CN211367711U[P]. 2020-08-28(in Chinese). [14] 钱 进,韩 晓.一种空心阴极磁控溅射靶:CN210481507U [P].2020-05-08. QIAN J, HAN X. The invention relates to a hollow cathode magnetron sputtering target: CN210481507U[P]. 2020-05-08(in Chinese). [15] BRÄUER G, SZYSZKA B, VERGHL M, et al. Magnetron sputtering-Milestones of 30 years[J]. Vacuum, 2010, 84(12): 1354-1359. [16] SPENCER A G, BISHOP C A, HOWSON R P. The design and performance of planar magnetron sputtering cathodes[J]. Vacuum, 1987, 37(3/4): 363-366. [17] 陈长琦,穆怀普,刘腾飞,等.旋转圆柱靶磁控溅射阴极的磁场模拟及结构设计[J].真空科学与技术学报,2012,32(10):913-918. CHEN C Q, MU H P, LIU T F, et al. Structure design of cylindrical rotating magnetron sputtering cathode and simulation of its magnetic field[J]. Chinese Journal of Vacuum Science and Technology, 2012, 32(10): 913-918(in Chinese). [18] CUI S H, WU Z Z, LIN H, et al. Hollow cathode effect modified time-dependent global model and high-power impulse magnetron sputtering discharge and transport in cylindrical cathode[J]. Journal of Applied Physics, 2019, 125(6): 063302. [19] OHRING M.薄膜材料科学[M].刘卫国等译.北京:国防工业出版社,2013. OHRING M. Materials science of thin films[M]. LIU W G et al. translated. Beijing: National Defense Industry Press, 2013(in Chinese). [20] 石晓倩,于荣环,乌云额尔德尼,等.基于磁控溅射靶的磁场分布优化[J].大连交通大学学报,2019,40(4):108-111. SHI XIAOQIAN, YU RONGHUAN, OYUNERDENE, et al. Optimization of magnetic field distribution based on magnetron spatteing targets[J]. Journal of Dalian Jiaotong University, 2019, 40(4): 108-111(in Chinese). [21] 佘鹏程,陈立宁,程文进,等.矩形磁控溅射靶电磁场分析及优化[J].电子工业专用设备,2017,46(4):35-38. SHE P C, CHEN L N, CHENG W J, et al. Electromagnetic field analysis and optimization of rectangular magnetron sputtering target[J]. Equipment for Electronic Products Manufacturing, 2017, 46(4): 35-38(in Chinese). [22] 孙智慧,钱 锋,樊 涛,等.旋转圆柱磁控溅射阴极设计和磁场强度分析计算[J].真空,2014,51(2):35-39. SUN Z H, QIAN F, FAN T, et al. Design of rotating cylindrical magnetron sputtering cathode and magnetic field strength analysis[J]. Vacuum, 2014, 51(2): 35-39(in Chinese). [23] 邹继斌.磁路与磁场[M].哈尔滨:哈尔滨工业大学出版社,1998. ZUO J B. Magnetic circuits and magnetic fields[M]. Harbin: Harbin Institution of Technology Press, 1998(in Chinese). |