
人工晶体学报 ›› 2026, Vol. 55 ›› Issue (5): 653-670.DOI: 10.16553/j.cnki.issn1000-985x.2025.0263
• 综合评述 • 下一篇
张虹1(
), 夏佳琪2, 居一方1(
), 张书隆2, 杭寅2,3(
)
收稿日期:2025-12-31
出版日期:2026-05-20
发布日期:2026-06-09
通信作者:
居一方,讲师。E-mail:juyifang@jssvc.edu.cn;作者简介:张虹(1990—),女,江苏省人,硕士,讲师。E-mail:zhanghong@jssvc.edu.cn
基金资助:
ZHANG Hong1(
), XIA Jiaqi2, JU Yifang1(
), ZHANG Shulong2, HANG Yin2,3(
)
Received:2025-12-31
Online:2026-05-20
Published:2026-06-09
摘要: 金刚石集众多优良性能于一身,具有天然材料中最大的硬度、最高的热导率,宽通光波段和优异的电学特性,在精密加工、电子信息、国防军工和航空航天等领域都具有重要应用。近年来,微波等离子化学气相沉积(MPCVD)技术的持续进步显著拓宽了金刚石材料的应用场景。其终端应用已从最初的磨料磨具逐步向多种高附加值领域拓展:在珠宝行业实现高质量培育钻石合成,在热管理领域为高功率器件提供高效散热方案,在光学窗口应用中展现优异的红外透过与激光耐受性能,在半导体、量子技术等领域呈现突破性潜力。本文系统阐述了MPCVD金刚石制备技术的核心原理与生长调控方法,从技术原理、性能优化、产业应用和瓶颈突破的逻辑主线,深入分析MPCVD金刚石在培育钻石、热管理、光学、半导体四大领域的应用现状、核心技术难点与研究进展,结合技术发展趋势与市场需求,展望其在新一代功率电子、航空航天等前沿领域的应用前景,为MPCVD金刚石的技术升级与产业化落地提供理论参考与方向指引。
中图分类号:
张虹, 夏佳琪, 居一方, 张书隆, 杭寅. MPCVD金刚石的应用研究现状及展望[J]. 人工晶体学报, 2026, 55(5): 653-670.
ZHANG Hong, XIA Jiaqi, JU Yifang, ZHANG Shulong, HANG Yin. Application Status and Prospects of MPCVD Diamond[J]. Journal of Synthetic Crystals, 2026, 55(5): 653-670.
图1 MPCVD生长金刚石的设备和原理[19]。(a)MPCVD装置示意图;(b)金刚石活性基团生长模型
Fig.1 Equipment and principle for MPCVD diamond growth[19]. (a) Schematic diagram of the MPCVD equipment; (b) active species growth model of diamond
图2 以68 μm/h的生长速率重复24次高速生长,生长出的厚度为10 mm的4.65 ct单晶金刚石[29]
Fig.2 A 4.65 ct single-crystal diamond with the thickness of 10 mm grown by 24 times repetition of high rate growth with the growth rate of 68 μm/h[29]
图3 面积为40 mm×60 mm、厚度为1.8 mm的马赛克外延晶片,由24块单晶金刚石板组成[31]
Fig.3 A mosaic wafer 40 mm×60 mm in area and 1.8 mm thick consisting of 24 single crystal diamond plates[31]
图4 IBI-BLG机制的详细描述(a)~(e)和Ir/YSZ/Si(001)衬底异质外延合成的未抛光自支撑金刚石单晶(f)[36]
Fig.4 A detailed description of the IBI-BLG mechanism (a)~(e) and the freestanding unpolished diamond single crystal (f) synthesized by heteroepitaxy on Ir/YSZ/ Si(001)[36]
图5 基于SAB技术键合的样品[54]。(a)GaN/金刚石键合样品的示意图;(b)样品低放大率横截面TEM照片;(c)键合GaN/金刚石样品光学显微镜照片;(d)700 ℃退火后GaN/金刚石样品光学显微镜照片
Fig.5 Diamond-on-GaN bonded based on SAB technology[54]. (a) Schematic diagram of GaN/diamond bonded sample; (b) low magnification cross-sectional TEM image of the sample; (c) optical microscope image of the bonded GaN/diamond sample; (d) optical microscope image of the GaN/diamond sample after annealing at 700 ℃
图7 基于Si3N4过渡层制备的金刚石基GaN及其界面热阻[58]。(a)不同比例的STEM照片,显示了成核层的厚度和Si3N4层的剩余厚度;(b)具有两种不同Si3N4厚度的金刚石/Si3N4/GaN的界面热阻
Fig.7 GaN-on-diamond prepared with an Si3N4 transition layer and its interface thermal resistance[58]. (a) STEM images with different scales showing the thickness of the nucleation layer and the remaining thickness of the Si3N4 layer; (b) diamond/Si3N4/GaN TBR with two different Si3N4 thicknesses
图9 不同金刚石粒径增强的Cu-B/金刚石复合材料的测量导热系数、预测导热系数和相应的界面导热系数(a), 以及热导率比较(b)[76]
Fig.9 Cu-B/diamond composites reinforced with various diamond particle sizes for measured thermal conductivity and predicted thermal conductivity, along with the corresponding interfacial thermal conductance (a) and comparison of thermal conductivity (b)[76]
| 应用领域 | 研究团队 | 材料/结构设计 | 关键技术/方法 | 主要成果与性能指标 | 参考文献 |
|---|---|---|---|---|---|
| SiC散热 | 山东大学 | 4H-SiC基底上直接生长多晶金刚石 | SiC减薄、金刚石沉积 | GaN器件表面温度降低52.5 ℃,热阻降低约41% | [ |
| Ga2O3散热 | 复旦大学 | 界面引入AlN中间层 | 脉冲激光沉积 | 热导率提升至6.0 W/(m·K),界面热导提升至60.9 MW/(m2·K) | [ |
| GaN HEMT散热 | 大阪市立大学 | GaN与单晶金刚石直接键合 | 表面活化键合(SAB)、退火优化 | 键合界面稳定,可承受700 ℃高温工艺,机械强度高 | [ |
| GaN HEMT散热 | 日本产业技术 综合研究所 | 金刚石表面沉积~1 nm Si粘合层 | SAB低温键合 | 界面非晶层<2 nm,剪切强度4.4 MPa,界面热阻<10 m2·K·GW-1 | [ |
| GaN HEMT散热 | 斯坦福大学 | Si3N4保护层,聚合物辅助植晶 | 高密度植晶、薄形核层控制 | 植晶密度>10-2 cm-2,界面热阻低至3.1 m2·K·GW-1 | [ |
| GaN HEMT散热 | 西安交通大学 | 双侧金刚石生长(牺牲层+散热层) | 低温沉积牺牲层、应力调控 | GaN衬底残余应力降至0.5 GPa,界面结合强度高 | [ |
| 封装散热 | 北京科技大学 | Cu-B/金刚石复合材料,调控金刚石粒径 | 基体合金化(B)、界面碳化物控制 | 金刚石粒径701 μm时热导率达904 W/(m·K) | [ |
| 封装散热 | 北京科技大学 | 双峰金刚石颗粒、原位碳化物夹层 | 协同界面设计、 高密度烧结 | 热导率达1 050 W/(m·K),创同类材料新高 | [ |
表1 近年来MPCVD金刚石在热管理领域应用的代表性研究进展
Table 1 Representative research progress of MPCVD diamond in the field of thermal management in recent years
| 应用领域 | 研究团队 | 材料/结构设计 | 关键技术/方法 | 主要成果与性能指标 | 参考文献 |
|---|---|---|---|---|---|
| SiC散热 | 山东大学 | 4H-SiC基底上直接生长多晶金刚石 | SiC减薄、金刚石沉积 | GaN器件表面温度降低52.5 ℃,热阻降低约41% | [ |
| Ga2O3散热 | 复旦大学 | 界面引入AlN中间层 | 脉冲激光沉积 | 热导率提升至6.0 W/(m·K),界面热导提升至60.9 MW/(m2·K) | [ |
| GaN HEMT散热 | 大阪市立大学 | GaN与单晶金刚石直接键合 | 表面活化键合(SAB)、退火优化 | 键合界面稳定,可承受700 ℃高温工艺,机械强度高 | [ |
| GaN HEMT散热 | 日本产业技术 综合研究所 | 金刚石表面沉积~1 nm Si粘合层 | SAB低温键合 | 界面非晶层<2 nm,剪切强度4.4 MPa,界面热阻<10 m2·K·GW-1 | [ |
| GaN HEMT散热 | 斯坦福大学 | Si3N4保护层,聚合物辅助植晶 | 高密度植晶、薄形核层控制 | 植晶密度>10-2 cm-2,界面热阻低至3.1 m2·K·GW-1 | [ |
| GaN HEMT散热 | 西安交通大学 | 双侧金刚石生长(牺牲层+散热层) | 低温沉积牺牲层、应力调控 | GaN衬底残余应力降至0.5 GPa,界面结合强度高 | [ |
| 封装散热 | 北京科技大学 | Cu-B/金刚石复合材料,调控金刚石粒径 | 基体合金化(B)、界面碳化物控制 | 金刚石粒径701 μm时热导率达904 W/(m·K) | [ |
| 封装散热 | 北京科技大学 | 双峰金刚石颗粒、原位碳化物夹层 | 协同界面设计、 高密度烧结 | 热导率达1 050 W/(m·K),创同类材料新高 | [ |
图10 金刚石激光输出特性[85]。(a)斯托克斯输出和残余泵浦功率变化;(b)泵浦与斯托克斯输出在1 h内长期功率稳定性;(c)自由运行的V形金刚石拉曼激光器中泵浦线宽60 kHz;(d)斯托克斯输出线宽为105 kHz
Fig.10 Output characteristics of diamond laser[85]. (a) The powers of the Stokes output and residual pump as a function of pump power; (b) long-term power stability of pump and Stokes output for 1 h; (c) linewidth of pump in the free-running V-shaped diamond Raman laser (DRL) is 60 kHz; (d) linewidth of Stokes output is 105 kHz
图12 HPHT退火前、后金刚石的吸收和透过光谱[98]。(a)~(c)不同退火温度、退火时间的吸收光谱;(d)金刚石透射光谱
Fig.12 UV-Visible absorption spectra and transmittance spectra of diamonds before and after annealing treatment[98]. (a)~(c) Absorption spectra at different annealing temperatures and time; (d) transmission spectra of diamond samples
图13 “异质集成静电掺杂”新策略[105]。(a)掺硼p型金刚石与单层n-MoS2异质集成示意图;(b)室温整流
Fig.13 New strategy of “heterogeneous integrated electrostatic doping”[105]. (a) Heterogenous integration of boron-doped p-diamond with monolayer n-MoS2; (b) room temperature rectification
图14 在一块氧终端金刚石上沉积的Au、Ag、Pt、W和Pd五种金属和金刚石之间的肖特基势垒高度和功函数(a),以及肖特基结能带图(b)[113]
Fig.14 Schottky barrier height and work function between the five metals (Au, Ag, Pt, W, and Pd) deposited on an oxygen-terminated diamond and the diamond (a), and Schottky junction band diagram (b)[113]
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