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人工晶体学报 ›› 2025, Vol. 54 ›› Issue (2): 312-318.DOI: 10.16553/j.cnki.issn1000-985x.2024.0284

• 器件制备 • 上一篇    下一篇

MOCVD生长的外延层掺杂氧化镓场效应晶体管

郁鑫鑫1, 沈睿1,2, 于含3, 张钊3, 赛青林4, 陈端阳4,5, 杨珍妮5,6, 谯兵1, 周立坤1, 李忠辉1,2, 董鑫3, 张洪良6, 齐红基4,5, 陈堂胜2   

  1. 1.南京电子器件研究所,中国电科碳基电子重点实验室,南京 210016;
    2.固态微波器件与电路全国重点实验室,南京 210016;
    3.吉林大学电子科学与工程学院,集成光电子国家重点实验室,长春 130012;
    4.中国科学院上海光学精密机械研究所,上海 201800;
    5.杭州富加镓业科技有限公司,杭州 311421;
    6.厦门大学化学化工学院,厦门 361005
  • 收稿日期:2024-11-20 出版日期:2025-02-15 发布日期:2025-03-04
  • 通信作者: 李忠辉,博士,研究员,E-mail:zhonghuili@126.com
  • 作者简介:郁鑫鑫(1988—),男,江苏省人,博士,高级工程师。E-mail:yuxx711@126.com
  • 基金资助:
    国家重点研发计划(2022YFB3605504)

β-Ga2O3 Field-Effect Transistors with Doped Epitaxial Layer Grown by MOCVD

YU Xinxin1, SHEN Rui1, 2, YU Han3, ZHANG Zhao3, SAI Qinglin4, CHEN Duanyang4, 5, YANG Zhenni5, 6, QIAO Bing1, ZHOU Likun1, LI Zhonghui1, 2, DONG Xin3, ZHANG Hongliang6, QI Hongji4, 5, CHEN Tangsheng2   

  1. 1. CETC Key Laboratory of Carbon-based Electronics, Nanjing Electronic Devices Institute, Nanjing 210016, China;
    2. National Key Laboratory of Solid-State Microwave Devices and Circuits, Nanjing 210016, China;
    3. State Key Laboratory on Integrated Optoelectronics, College of Electronic Science and Engineering, Jilin University, Changchun 130012, China;
    4. Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai 201800, China;
    5. Fujia Gallium Technology Co. Ltd., Hangzhou 311421, China;
    6. College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, China
  • Received:2024-11-20 Online:2025-02-15 Published:2025-03-04

摘要: 本文基于Ga2O3 MOCVD外延材料,开展了Ga2O3场效应晶体管的研制和性能研究。为了降低器件的导通电阻,优化了外延层设计,将掺杂浓度提高至1×1018 cm-3以上。通过长沟道器件提取的外延层的电子浓度和场效应迁移率分别为2×1018 cm-3和55 cm2/(V·s),相应的沟道方阻为10.3 kΩ/sq。研制的栅漏间距2和16 μm的Ga2O3 MOSFET器件的比导通电阻分别为2.3和40.0 mΩ·cm2,对应的击穿电压分别达到458和2 324 V。为了进一步提升器件的击穿电压,采用p型NiO制备栅电极,研制的Ga2O3 JFET器件导通电阻显著增大,但击穿电压分别提升至755和3 000 V以上。计算了不同栅漏间距器件的功率优值(P-FOM),发现其随栅漏间距的增加先增大后减小,其中栅漏间距为8 μm的Ga2O3 MOSFET器件获得了最高的P-FOM,达到了192 MW/cm2,表明MOCVD外延技术在Ga2O3功率器件上具有重要的应用前景。

关键词: 氧化镓, MOCVD外延, 掺杂, 比导通电阻, 击穿电压, 功率优值

Abstract: In this paper, the Ga2O3 field-effect transistors were fabricated on the Ga2O3 epitaxial material grown by MOCVD, and their performances were studied. In order to reduce the on-resistances of the transistors, the epitaxial layer was optimally designed and the doping concentration was increased to above 1×1018 cm-3. The electron concentration and field-effect mobility of the epitaxial layer extracted from the long channel transistor were 2×1018 cm-3 and 55 cm2/(V·s), respectively, which result in a corresponding channel sheet resistance of 10.3 kΩ/sq. The specific on-resistances of the Ga2O3 MOSFETs with gate to drain spacings of 2 and 16 μm were 2.3 and 40.0 mΩ·cm2, and the corresponding breakdown voltages were 458 and 2 324 V, respectively. In order to further improve the breakdown voltages of the transistors, the p-type NiO gates were employed. The on-resistances of the fabricated Ga2O3 JFETs were significantly increased, but the breakdown voltages were improved to 755 V and above 3 000 V, respectively. The power figure of merits (P-FOMs) of the transistors with different gate to drain spacings were calculated, and it was found that they increased first and then decreased with the increase of the gate to drain spacings. The Ga2O3 MOSFET with a gate to drain spacing of 8 μm achieved the highest P-FOM, which was 192 MW/cm2, indicating the MOCVD epitaxial technology demonstrates an important application prospect for Ga2O3 power transistors.

Key words: gallium oxide, MOCVD epitaxial, doping, specific on-resistance, breakdown voltage, power figure of merit

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