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人工晶体学报 ›› 2026, Vol. 55 ›› Issue (1): 52-57.DOI: 10.16553/j.cnki.issn1000-985x.2025.0159

• 研究论文 • 上一篇    下一篇

垂直布里奇曼法生长4英寸Fe掺杂(010) β -氧化镓及其性能表征

李明1,2(), 叶浩函1,2, 王琤3, 沈典宇3, 王芸霞3, 王嘉君3, 夏宁3, 张辉1,2(), 杨德仁1,2   

  1. 1.浙江大学材料科学与工程学院,硅及先进半导体全国重点实验室,杭州 310027
    2.浙江大学杭州国际科创中心先进半导体研究院,杭州 310027
    3.杭州镓仁半导体有限公司,杭州 311200
  • 收稿日期:2025-07-24 出版日期:2026-01-20 发布日期:2026-02-05
  • 通信作者: 张辉
  • 作者简介:李 明(1991—),男,浙江省人,博士。E-mail:0623643@zju.edu.cn
  • 基金资助:
    浙江省“尖兵”“领雁”研发攻关计划(2023C01193);国家重点研发计划(2024YFE0205300)

Growth and Properties of 4-Inch Fe Doped (010) β -Gallium Oxide Using Vertical Bridgman Method

LI Ming1,2(), YE Haohan1,2, WANG Cheng3, SHEN Dianyu3, WANG Yunxia3, WANG Jiajun3, XIA Ning3, ZHANG Hui1,2(), YANG Deren1,2   

  1. 1. State Key Laboratory of Silicon and Advanced Semiconductor Materials,School of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China
    2. Institute of Advanced Semiconductors,Hangzhou Global Scientific and Technological Innovation Center,Zhejiang University,Hangzhou 310027,China
    3. Hangzhou Garen Semiconductor Company Limited,Hangzhou 311200,China
  • Received:2025-07-24 Online:2026-01-20 Published:2026-02-05
  • Contact: ZHANG Hui

摘要: 本文采用自主设计的垂直布里奇曼(VB)晶体生长系统,结合仿真迭代优化温场结构,成功实现了以微凸固液界面与适宜温度梯度生长大尺寸、高质量的Fe掺杂β相半绝缘氧化镓(β-Ga2O3)单晶。经加工制备出高质量的4英寸(010)取向半绝缘衬底。对该衬底的结晶质量、表面形貌及电学性能进行系统表征。测试结果表明,衬底无裂纹等宏观缺陷,X射线摇摆曲线半峰全宽(FWHM)均低于50″,显示出优良的结晶质量。表面形貌分析显示,衬底最大表面粗糙度为0.074 nm,局部厚度偏差(LTV)小于3.4 μm,总厚度偏差(TTV)为4.157 μm,翘曲度(Warp)和弯曲度(Bow)分别为5.886和1.103 μm,说明衬底加工质量良好。电学测试表明,衬底平均电阻率达7.9×1010 Ω·cm,面内不均匀性为7.77%,证明VB法在实现均匀掺杂方面表现优异,具备应用于微波射频(RF)器件的潜力。

关键词: 氧化镓; 宽禁带半导体; 晶体生长; 垂直布里奇曼; 单晶衬底; 掺杂

Abstract: In this study, a self-built vertical Bridgman (VB) system was utilized to grow large-size, high-quality Fe-doped β-Ga2O3 single crystals. Through iterative thermal field optimization via simulation, slightly convex solid-liquid interface and appropriate temperature gradient were achieved. The as-grown crystal was further processed into a high-quality 4-inch (010) oriented semi-insulating substrate. Comprehensive evaluations of crystallinity, surface morphology, and electrical properties were carried out. The substrate exhibits no macroscopic defects such as cracks. Multi-point X-ray rocking curve measurements show full width at half maximum (FWHM) values all below 50″, indicating superior crystalline quality. Surface topography tests reveal a maximum roughness of 0.074 nm, local thickness variation (LTV) below 3.4 μm, total thickness variation (TTV) of 4.157 μm, warp of 5.886 μm, and bow of 1.103 μm, demonstrating excellent processing quality. Moreover, the substrate displays high average resistivity of approximately 7.9×1010 Ω·cm with an in-plane inhomogeneity of about 7.77%, underscoring the effectiveness of VB method in achieving uniform doping distribution and its potential for radio frequency (RF) and microwave device applications.

Key words: Ga2O3; wide-bandgap semiconductor; crystal growth; vertical Bridgman; single crystal substrate; doping

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