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人工晶体学报 ›› 2025, Vol. 54 ›› Issue (9): 1574-1583.DOI: 10.16553/j.cnki.issn1000-985x.2025.0065

• 研究论文 • 上一篇    下一篇

低温超临界流体工艺对退化的Ni/β-Ga2O3肖特基势垒二极管电学性能的影响

宋昱杉1(), 陈浩1, 李松1, 杨明超1, 杨松泉1, 杨森1, 周磊簜1(), 耿莉1(), 郝跃2, 欧阳晓平3   

  1. 1.西安交通大学微电子学院,西安 710049
    2.西安电子科技大学微电子学院,西安 710071
    3.西北核技术研究所,西安 710024
  • 收稿日期:2025-03-31 出版日期:2025-09-20 发布日期:2025-09-23
  • 通信作者: 周磊簜,耿莉
  • 作者简介:宋昱杉(1997—),男,河北省人,博士研究生。E-mail:yushansong@stu.xjtu.edu.cn
  • 基金资助:
    国家重点实验室稳定支持基金(JBSY252800260);宽禁带半导体器件与集成技术全国重点实验室开放基金(2413S121);国家自然科学基金(62204198)

Effect of Low-Temperature Supercritical Fluid Process on Electrical Performance of Degraded Ni/β-Ga2O3 Schottky Barrier Diodes

SONG Yushan1(), CHEN Hao1, LI Song1, YANG Mingchao1, YANG Songquan1, YANG Sen1, ZHOU Leidang1(), GENG Li1(), HAO Yue2, OUYANG Xiaoping3   

  1. 1.School of Microelectronics,Xi'an Jiaotong University,Xi'an 710049,China
    2.School of Microelectronics,Xidian University,Xi'an 710071,China
    3.Northwest Institute of Nuclear Technology,Xi'an 710024,China
  • Received:2025-03-31 Online:2025-09-20 Published:2025-09-23
  • Contact: ZHOU Leidang, GENG Li

摘要: 先进半导体工艺是提升β-Ga2O3基器件电学性能和修复其在工作环境中性能退化效应的关键技术。近年来,低温超临界流体工艺在降低半导体器件界面态、修复刻蚀工艺损伤和提高器件稳定性等方面展现出显著优势。本研究采用130 ℃和20 MPa的N2O流体,对暴露在空气环境中导致电学性能退化的Ni/β-Ga2O3肖特基势垒二极管(SBDs)进行处理,通过电流-电压和电容-电压特性表征,探究低温超临界流体(SCF)处理前、后电学性能退化的SBDs器件导通特性和击穿特性的变化机理。研究结果表明:经SCF处理的SBDs正向饱和电流密度的升高伴随着体电子陷阱的减少和串联电阻的降低;肖特基势垒高度的提高和耗尽层的展宽有效抑制了电子隧穿,进而导致了漏电流的减小。此外,研究表明,退化后的Ni/β-Ga2O3 SBDs的金半接触界面态密度未受到SCF处理的显著影响,具有大时间常数的界面缺陷也未对肖特基势垒高度产生明显影响。本研究为低温超临界流体工艺在优化β-Ga2O3基器件性能方面的应用提供了重要的实验依据和理论支持。

关键词: 低温超临界流体工艺; 超宽禁带半导体; β-Ga2O3; 肖特基势垒二极管; 界面态密度; 电学性能

Abstract: Advanced semiconductor processes are the key technology for enhancing the electrical performance of β-Ga2O3-based devices and mitigating their degradation issues in service environments. Recent studies have demonstrated that low-temperature supercritical fluid process exhibits remarkable advantages in reducing interface states of semiconductor devices, repairing etching process damage, and improving device stability. In this study, low-temperature supercritical fluid (SCF) treatment was employed on Ni/β-Ga2O3 Schottky barrier diodes (SBDs) that has undergone degradation in air environment. The process was carried out at 130 ℃ and 20 MPa in N2O fluid, and then the mechanism of changes in conductivity and breakdown characteristics of the degraded SBDs before and after SCF treatment were systematically investigated by current-voltage and capacitance-voltage measurements. The results demonstrate that the increase in forward saturation current density of SBDs with SCF treatment is accompanied by bulk traps reduction and series resistance decrease. Schottky barrier height elevation and depletion layer broadening effectively inhibit the electron tunneling, leading to leakage current reduction. Additionally, the study illuminates that interface state density of degraded Ni/β-Ga2O3 SBDs is not significantly affected by SCF treatment, and the interface traps with large time constants do not significantly affect the Schottky barrier height. This study provides critical experimental evidence and theoretical support for the application of low-temperature supercritical fluid process in optimizing the performance of β-Ga2O3-based devices.

Key words: low-temperature supercritical fluid process; ultrawide bandgap semiconductor; β-Ga2O3; Schottky barrier diode; interface state density; electrical performance

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