
人工晶体学报 ›› 2026, Vol. 55 ›› Issue (3): 439-451.DOI: 10.16553/j.cnki.issn1000-985x.2025.0222
赵琪(
), 刘奕豪, 齐小方, 马文成(
), 徐永宽, 胡章贵
收稿日期:2025-10-22
出版日期:2026-03-20
发布日期:2026-04-08
通信作者:
马文成,博士,副教授。E-mail:wcma@email.tjut.edu.cn作者简介:赵琪(2001—),男,内蒙古自治区人,硕士研究生。E-mail:1241445924@qq.com
基金资助:
ZHAO Qi(
), LIU Yihao, QI Xiaofang, MA Wencheng(
), XU Yongkuan, HU Zhanggui
Received:2025-10-22
Online:2026-03-20
Published:2026-04-08
摘要: β相氧化镓晶体(β-Ga2O3)因具有超宽禁带特性成为高功率器件的关键材料,垂直布里奇曼(VB)法是目前最有机会实现商业化生长氧化镓单晶的方法。然而,氧化镓晶体与熔体的半透明性会引发显著的内辐射传热,该效应会影响晶体生长过程中的温场与流场,进而影响晶体质量。因此本文采用有限元软件Comsol Multiphysics建立VB法氧化镓晶体生长过程的传热数值模型,系统探究了内辐射传热对温场、熔体流场、固液界面和晶体热应力的影响规律。数值模拟结果表明,晶体内辐射传热会显著增强晶体热输运,来自固液界面的辐射传热可以直接穿透半透明晶体至坩埚壁,降低晶体内部温度梯度与热应力,该辐射传热对固液界面产生直接辐射冷却,因此固液界面处温度有下降的趋势。为了维持熔点温度,固液界面必须向上部高温熔体移动,固液界面凸度增加。熔体内辐射传热也会影响熔体区域的热量传递,来自热区的辐射传热会穿透熔体至固液界面,起到辐射加热固液界面的效果,因此固液界面向晶体侧移动,固液界面形状凸度变小,呈W型分布,但由于晶体等温线与热应力主要聚集在晶体底部,对晶体内部温度梯度与热应力影响很小。此外,本文还系统分析了内辐射传热对晶体/熔体吸收系数的敏感性,发现随着晶体吸收系数减小,晶体内辐射传热作用增强,熔体和晶体内温度梯度减小,晶体热应力减小,固液界面凸度增加,将导致溶质径向分布不均。随着熔体吸收系数的减小,熔体内辐射增强,晶体底部温度梯度与热应力略有下降,固液界面中心凸度变小,W型分布更加明显,边缘更易多晶成核,进而影响晶体质量。
中图分类号:
赵琪, 刘奕豪, 齐小方, 马文成, 徐永宽, 胡章贵. 垂直布里奇曼法 β-Ga2O3晶体生长过程中的内辐射传热研究[J]. 人工晶体学报, 2026, 55(3): 439-451.
ZHAO Qi, LIU Yihao, QI Xiaofang, MA Wencheng, XU Yongkuan, HU Zhanggui. Internal Radiation During β -Ga2O3 Crystal Growth Process by Vertical Bridgman Method[J]. Journal of Synthetic Crystals, 2026, 55(3): 439-451.
| Material | Variable | Value |
|---|---|---|
| Ga2O3 melt | Density/(kg·m-3) | 6 000 |
| Thermal conductivity(W·m-1·K-1) | 3.5 | |
| Heat capacity/(J·kg-1·K-1) | 800 | |
| Latent heat/(kJ·kg-1) | 535.5 | |
| Dynamic viscosity/(kg·m-1·s-1) | 0.1 | |
| Surface emissivity | 0.5 | |
| Thermal expansion/K-1 | 1.8×10-5 | |
| Refractive index | 1.9 | |
| Ga2O3 crystal | Density/(kg·m-3) | 5 950 |
| Thermal conductivity(W·m-1·K-1) | 1.07 | |
| Heat capacity/(J·kg-1·K-1) | 720 | |
| Melting point/K | 2 068 | |
| Surface emissivity | 0.3 | |
| Thermal expansion/K-1 | 3.4×10-6 | |
| Elastic modulus/GPa | 200 | |
| Poisson ratio | 0.26 | |
| Al2O3 | Density/(kg·m-3) | 3 965 |
| Thermal conductivity/(W·m-1·K-1) | 35 | |
| Heat capacity/(J·kg-1·K-1) | 730 | |
| Surface emissivity | 0.75 | |
| Pt-20%Rh | Density/(kg·m-3) | 20 500 |
| Thermal conductivity/(W·m-1·K-1) | 70.05 | |
| Heat capacity/(J·kg-1·K-1) | 133 | |
| Surface emissivity | 0.75 | |
| Felt | Density/(kg·m-3) | 120 |
| Thermal conductivity/(W·m-1·K-1) | 1.2 | |
| Heat capacity/(J·kg-1·K-1) | 1 890 | |
| Surface emissivity | 0.8 |
表1 主要材料的热物性参数[17,19,21?22]
Table 1 Thermophysical parameters of main materials[17,19,21?22]
| Material | Variable | Value |
|---|---|---|
| Ga2O3 melt | Density/(kg·m-3) | 6 000 |
| Thermal conductivity(W·m-1·K-1) | 3.5 | |
| Heat capacity/(J·kg-1·K-1) | 800 | |
| Latent heat/(kJ·kg-1) | 535.5 | |
| Dynamic viscosity/(kg·m-1·s-1) | 0.1 | |
| Surface emissivity | 0.5 | |
| Thermal expansion/K-1 | 1.8×10-5 | |
| Refractive index | 1.9 | |
| Ga2O3 crystal | Density/(kg·m-3) | 5 950 |
| Thermal conductivity(W·m-1·K-1) | 1.07 | |
| Heat capacity/(J·kg-1·K-1) | 720 | |
| Melting point/K | 2 068 | |
| Surface emissivity | 0.3 | |
| Thermal expansion/K-1 | 3.4×10-6 | |
| Elastic modulus/GPa | 200 | |
| Poisson ratio | 0.26 | |
| Al2O3 | Density/(kg·m-3) | 3 965 |
| Thermal conductivity/(W·m-1·K-1) | 35 | |
| Heat capacity/(J·kg-1·K-1) | 730 | |
| Surface emissivity | 0.75 | |
| Pt-20%Rh | Density/(kg·m-3) | 20 500 |
| Thermal conductivity/(W·m-1·K-1) | 70.05 | |
| Heat capacity/(J·kg-1·K-1) | 133 | |
| Surface emissivity | 0.75 | |
| Felt | Density/(kg·m-3) | 120 |
| Thermal conductivity/(W·m-1·K-1) | 1.2 | |
| Heat capacity/(J·kg-1·K-1) | 1 890 | |
| Surface emissivity | 0.8 |
图2 晶体/熔体均不透明时不同生长阶段的温场、流场和von Mises应力图
Fig.2 Temperature fields, flow fields, and von Mises stress diagrams at different growth stages when both the crystal and the melt are opaque
图3 晶体半透明时不同生长阶段的温场、流场和von Mises应力图
Fig.3 Temperature fields, flow fields, and von Mises stress diagrams at different growth stages when the crystal is semi-transparent
图4 熔体半透明时不同生长阶段的温场、流场和von Mises应力图
Fig.4 Temperature fields, flow fields, and von Mises stress diagrams at different growth stages when the melt is semi-transparent
图5 晶体/熔体均半透明时不同生长阶段的温场、流场和von Mises应力图
Fig.5 Temperature fields, flow fields, and von Mises stress diagrams at different growth stages when both the crystal and the melt are semi-transparent
图6 不同内辐射传热条件下,初期(a)、中期(b)和末期(c)的熔体-晶体界面形状对比
Fig.6 Comparison of melt-crystal interface shapes under different internal radiation conditions at early stage (a), middle stage (b), and late stage (c)
图9 内辐射传热对晶体底部沿中心线的温度梯度(a)和von Mises应力(b)的影响
Fig.9 Influence of internal radiation on the temperature gradient (a) and von Mises stress (b) along the centerline at the bottom of the crystal
图10 晶体吸收系数对沿晶体外围的温度梯度(a)和von Mises应力分布(b)的影响
Fig.10 Influence of crystal absorption coefficient on the temperature gradient (a) and von Mises stress distribution (b) along the periphery of the crystal
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