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人工晶体学报 ›› 2025, Vol. 54 ›› Issue (12): 2083-2100.DOI: 10.16553/j.cnki.issn1000-985x.2025.0109

• 研究论文 • 上一篇    下一篇

温度梯度对PVT法生长大尺寸SiC断裂应力的影响

许彬杰1,2(), 陈鹏阳1,2(), 卢圣瓯1,2, 宣玲玲1,2, 王安琦1,2, 王帆1,2, 皮孝东1,2(), 杨德仁1,2, 韩学峰1,2()   

  1. 1.浙江大学材料科学与工程学院,硅及先进半导体材料全国重点实验室,杭州 310027
    2.浙江大学杭州国际科创中心,先进半导体研究院和浙江省宽禁带半导体重点实验室,杭州 311200
  • 收稿日期:2025-05-22 出版日期:2025-12-20 发布日期:2026-01-04
  • 通信作者: 皮孝东,博士,教授。E-mail:xdpi@zju.edu.cn;韩学峰,博士,研究员。E-mail:xuefenghan@zju.edu.cn
  • 作者简介:许彬杰(1990—),男,浙江省人,博士。E-mail:xubinjie@zju.edu.cn
    陈鹏阳(1997—),男,辽宁省人,硕士。E-mail:chenpengyang@naura.com
    本文共同第一作者。
  • 基金资助:
    浙江省“尖兵”“领雁”研发攻关计划(2023C01010);国家自然科学基金青年科学基金(52202189)

Effects of the Temperature Gradient on the Fracture Stress of Large-Sized SiC Grown by PVT Method

XU Binjie1,2(), CHEN Pengyang1,2(), LU Sheng’ou1,2, XUAN Lingling1,2, WANG Anqi1,2, WANG Fan1,2, PI Xiaodong1,2(), YANG Deren1,2, HAN Xuefeng1,2()   

  1. 1. State Key Laboratory of Silicon and Advanced Semiconductor Materials,School of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China
    2. Institute of Advanced Semiconductors & Zhejiang Provincial Key Laboratory of Power Semiconductor Materials and Devices,ZJU-Hangzhou Global Scientific and Technological Innovation Center,Hangzhou 311200,China
  • Received:2025-05-22 Online:2025-12-20 Published:2026-01-04

摘要: 断裂应力是制约物理气相传输(PVT)法制备碳化硅(SiC)单晶直径突破200 mm的关键。本研究通过对比计算4°离轴与正轴生长条件下的断裂应力,发现两者的断裂应力行为高度相似:基平面滑移对断裂应力的影响在两种生长条件下可忽略不计,而棱柱面滑移的影响几乎完全相同。此外,研究阐明了温度梯度对断裂应力的影响机制,证实了高温条件下断裂应力几乎全部由径向温度梯度主导,轴向温度梯度的贡献可忽略不计。通过模拟晶体形貌随时间的演化过程及晶体凸度与直径的变化,进一步揭示了断裂应力大小与径向温度梯度之间的关联规律。本研究为理解断裂应力与温度梯度的内在关系提供了新的见解,对预防PVT法生长过程中的SiC晶体断裂具有指导意义。

关键词: 碳化硅; 物理气相传输(PVT)法; 数值模拟; 单晶生长; 断裂应力; 温度梯度

Abstract: Fracture stress remains the primary barrier preventing the diameter of silicon carbide (SiC) single crystals grown by the physical vapor transport (PVT) method from exceeding 200 mm. In the present study, the fracture stress was calculated under both 4° off-axis and on-axis growth conditions. The results demonstrate comparable fracture behavior between the two growth conditions, with negligible contributions from basal plane slips and nearly identical effects of prismatic plane slips. Besides, the effects of the temperature gradient on the fracture stress were elaborated, suggesting that almost all fracture stresses arise from the radial temperature gradient at high temperatures, while the axial temperature gradient exhibits minimal effect. Further simulations investigated the effects of temporal shape evolution, crystal convexity, and diameter, revealing a consistent correlation between fracture stress magnitude and radial temperature gradient variation. This study provides furthsinsights into the fracture stress-temperature gradient relationship, offering guidance for fracture prevention during PVT growth.

Key words: silicon carbide; physical vapor transport (PVT) method; numerical simulation; single crystal growth; fracture stress; temperature gradient

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