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人工晶体学报 ›› 2025, Vol. 54 ›› Issue (6): 986-996.DOI: 10.16553/j.cnki.issn1000-985x.2025.0019

• 研究论文 • 上一篇    下一篇

衬底类型对生长多晶金刚石膜应力和结晶度影响研究

李翔1(), 陈根2, 沈洁2, 祝铭辉3   

  1. 1.安徽大学物质科学与信息技术研究院,合肥 230039
    2.中国科学院合肥物质科学研究院,合肥 230031
    3.安徽工程大学机械与汽车工程学院,芜湖 241000
  • 收稿日期:2025-01-23 出版日期:2025-06-20 发布日期:2025-06-23
  • 作者简介:李翔(1999—),男,安徽省人,硕士研究生。E-mail:lx0415521@163.com

Effect of Substrate Type on Stress and Crystallinity of Growing Polycrystalline Diamond Film

LI Xiang1(), CHEN Gen2, SHEN Jie2, ZHU Minghui3   

  1. 1.Department of Material Science and Information Technology,University of Anhui,Hefei 230039,China
    2.Hefei Institutes of Physical Science,Chinese Academy of Sciences,Hefei 230031,China
    3.Faculty of Mechanical and Automotive Engineering,Anhui Polytechnic University,Wuhu 241000,China
  • Received:2025-01-23 Online:2025-06-20 Published:2025-06-23

摘要: 不同衬底材料会影响多晶金刚石的结晶度和应力。本文采用微波等离子体化学气相沉积(MPCVD)设备,研究三种不同衬底(W、Si和Mo)对沉积多晶金刚石膜应力和结晶度的影响。首先,为降低边缘效应,通过数值模拟、OES光谱分析方式优化并验证了沉积金刚石膜的最佳基台高度是16 mm。在相同工艺条件下生长多晶金刚石薄膜,利用拉曼光谱、SEM比较三种衬底沉积金刚石的结晶度和质量,三种衬底生长的金刚石晶面取向主要是(111),其中W衬底沉积的金刚石薄膜结晶度均匀性较高。XRD应力分析研究结果表明,W衬底沉积的多晶金刚石薄膜中心到边缘的应力分布较均匀且应力最小。最后,本团队利用W衬底沉积了直径为50.8 mm、沉积时间200 h、厚度0.6 mm、杂质缺陷少、无裂纹的多晶金刚石薄膜,并且中心至边缘的半峰全宽(FWHM)是8.156~8.715 cm-1。TEM表征结果显示,d(111)晶面间距是0.206 nm。表明W衬底较其他两种衬底更适合沉积多晶金刚石,制备用于光学、热学和电子等方面的多晶金刚石薄膜。本研究对沉积大尺寸、低应力、高结晶度多晶金刚石膜和应用于核聚变托卡马克装置的微波窗口提供了有效的参考。

关键词: 微波等离子体; 多晶金刚石薄膜; 衬底; 化学气相沉积; 结晶度; 应力

Abstract: Various substrate materials exert distinct influences on the crystallinity and stress of polycrystalline diamond films. This study investigates the impact of three substrates (W, Si, and Mo) on the stress and crystallinity of polycrystalline diamond films synthesized using microwave plasma chemical vapor deposition (MPCVD). Initially, to mitigate edge effects, numerical simulations and optical emission spectroscopy (OES) were employed to optimize and validate that the optimal base height for diamond film deposition is 16 mm. Growing polycrystalline diamond films under the same process conditions, the crystallinity and quality of diamond films deposited on these three substrates were evaluated via Raman spectroscopy and scanning electron microscopy (SEM). It is found that all diamond films exhibit a (111) orientation, with the W substrate yielding superior crystallinity uniformity. X-ray diffraction (XRD) stress analysis reveals that the polycrystalline diamond film deposited on the W substrate demonstrated uniform stress distribution from center to edge, with minimal stress levels. Consequently, a polycrystalline diamond film with a diameter of 50.8 mm, thickness of 0.6 mm, and deposition time of 200 h is successfully deposited on the W substrate, featuring few impurity defects, no cracks, and a full width at half maximum(FWHM) ranging from 8.156 cm-1 to 8.715 cm-1 from center to edge. Transmission electron microscopy (TEM) detected a d-spacing of 0.206 nm for the (111) crystal planes. These findings indicate that the W substrate is more suitable for depositing polycrystalline diamond films intended for optical, thermal, and electronic applications compared to Si and Mo substrates. This research provides valuable insights for the deposition of large-size, low-stress, high-crystallinity polycrystalline diamond films and the application of microwave windows in nuclear fusion tokamak devices.

Key words: microwave plasma; polycrystalline diamond film; substrate; chemical vapor deposition; crystallinity; stress

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